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MAX1567ETL Rev. A
RELIABILITY REPORT FOR MAX1567ETL PLASTIC ENCAPSULATED DEVICES
November 13, 2003
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR. SUNNYVALE, CA 94086
Written by
Reviewed by
Jim Pedicord Quality Assurance Reliability Lab Manager
Bryan J. Preeshl Quality Assurance Executive Director
Conclusion The MAX1567 sucessfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim's continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim's quality and reliability standards. Table of Contents I. ........Device Description II. ........Manufacturing Information III. .......Packaging Information IV. .......Die Information V. ........Quality Assurance Information VI. .......Reliability Evaluation ......Attachments
I. Device Description A. General The MAX1567 provides a complete power-supply solution for digital cameras. It improves performance, component count, and size compared to conventional multichannel controllers in 2-cell AA, 1-cell lithium-ion (Li+), and dualbattery designs. On-chip MOSFETs provide up to 95% efficiency for critical power supplies, while additional channels operate with external FETs for optimum design flexibility. This optimizes overall efficiency and cost, while also reducing board space. The MAX1567 includes six high-efficiency DC-to-DC conversion channels: * * * * * Step-up DC-to-DC converter with on-chip power FETs Main DC-to-DC converter with on-chip FETs, configurable to step either up or down Step-down core DC-to-DC converter with on-chip FETs DC-to-DC controller for white LEDs or other output Transformerless inverting DC-to-DC controller (typically for negative CCD bias)
All DC-to-DC channels operate at one fixed frequency settable from 100kHz to 1MHz to optimize size, cost, and efficiency. Other features include soft-start, power-OK outputs, and overload protection. The MAX1567 is available in space-saving 40-pin thin QFN packages. An evaluation kit is available to expedite designs. B. Absolute Maximum Ratings Item Rating
PV, PVSU, SDOK, AUX1OK, SCF, ON_, FB_, SUSD to GND -0.3V to +6V PG_ to GND -0.3V to +0.3V DL1, DL3, INDL2, PVM, PVSD to GND -0.3V to (PVSU + 0.3V) DL2 to GND -0.3V to (INDL2 + 0.3V) LXSU Current (Note 1) 3.6A LXM Current (Note 1) 3.6A LXSD Current (Note 1) 2.25A REF, OSC, CC_ to GND -0.3V to (PVSU + 0.3V) Operating Temperature Range -40C to +85C Junction Temperature +150C Storage Temperature Range -65C to +150C Lead Temperature (soldering, 10s) +300C Continuous Power Dissipation (TA = +70C) 40-Pin Thin QFN 2105mW Derates above +70C 40-Pin Thin QFN 26.3mW/C Note 1: LXSU has internal clamp diodes to PVSU and PGSU, LXM has internal clamp diodes to PVM and PGM, and LXSD has internal clamp diodes to PVSD and PGSD. Applications that forward bias these diodes should take care not to exceed the devices' power dissipation limits.
II. Manufacturing Information A. Description/Function: B. Process: C. Number of Device Transistors: D. Fabrication Location: E. Assembly Location: F. Date of Initial Production: Six-Channel, High-Efficiency, Digital Camera Power Supplies B8 (Standard 0.8 micron silicon gate CMOS) 9420 California, USA Thailand July, 2003
III. Packaging Information A. Package Type: B. Lead Frame: C. Lead Finish: D. Die Attach: E. Bondwire: F. Mold Material: G. Assembly Diagram: H. Flammability Rating: I. Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: 40-Lead Thin QFN (6 x 6) Copper Solder Plate Silver-Filled Epoxy Gold (1.3 mil dia.) Epoxy with silica filler # 05-9000-0520 Class UL94-V0
Level 1
IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backside Metallization: E. Minimum Metal Width: F. Minimum Metal Spacing: G. Bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 127 x 147 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Copper/Silicon None .8 microns (as drawn) .8 microns (as drawn) 5 mil. Sq. SiO2 Wafer Saw
V. Quality Assurance Information A. Quality Assurance Contacts: Jim Pedicord Bryan Preeshl Kenneth Huening
(Manager, Rel Oprations) (Executive Director of QA) (Vice President)
B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects. C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D VI. Reliability Evaluation A. Accelerated Life Test The results of the 135C biased (static) life test are shown in Table 1. Using these results, the Failure Rate () is calculated as follows: = 1 = MTTF 1.83 192 x 4389 x 48 x 2 (Chi square value for MTTF upper limit)
Thermal acceleration factor assuming a 0.8eV activation energy = 22.62 x 10-9 = 22.62 F.I.T. (60% confidence level @ 25C)
This low failure rate represents data collected from Maxim's reliability qualification and monitor programs. Maxim also performs weekly Burn-In on samples from production to assure the reliability of its processes. The reliability required for lots which receive a burn-in qualification is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece sample. Maxim performs failure analysis on lots exceeding this level. The following Burn-In Schematic (Spec. #06-6202) shows the static circuit used for this test. Maxim also performs 1000 hour life test monitors quarterly for each process. This data is published in the Product Reliability Report (RR-1M). B. Moisture Resistance Tests Maxim evaluates pressure pot stress from every assembly process during qualification of each new design. Pressure Pot testing must pass a 20% LTPD for acceptance. Additionally, industry standard 85C/85%RH or HAST tests are performed quarterly per device/package family. C. E.S.D. and Latch-Up Testing The PN07-1 die type has been found to have all pins able to withstand a transient pulse of +/-800V, per Mil-Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device withstands a current of 250mA.
Table 1 Reliability Evaluation Test Results MAX1567ETL TEST ITEM TEST CONDITION FAILURE IDENTIFICATION SAMPLE SIZE NUMBER OF FAILURES
Static Life Test (Note 1) Ta = 135C Biased Time = 192 hrs. Moisture Testing (Note 2) Pressure Pot Ta = 121C P = 15 psi. RH= 100% Time = 168hrs. Ta = 85C RH = 85% Biased Time = 1000hrs.
DC Parameters & functionality
48
0
DC Parameters & functionality
77
0
85/85
DC Parameters & functionality
77
0
Mechanical Stress (Note 2) Temperature Cycle -65C/150C 1000 Cycles Method 1010 DC Parameters & functionality 77 0
Note 1: Life Test Data may represent plastic D.I.P. qualification lots. Note 2: Generic package/process data
Attachment #1 TABLE II. Pin combination to be tested. 1/ 2/
Terminal A (Each pin individually connected to terminal A with the other floating) 1. 2. All pins except VPS1 3/ All input and output pins
Terminal B (The common combination of all like-named pins connected to terminal B) All VPS1 pins All other input-output pins
1/ Table II is restated in narrative form in 3.4 below. 2/ No connects are not to be tested. 3/ Repeat pin combination I for each named Power supply and for ground (e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc). 3.4 a. Pin combinations to be tested. Each pin individually connected to terminal A with respect to the device ground pin(s) connected to terminal B. All pins except the one being tested and the ground pin(s) shall be open. Each pin individually connected to terminal A with respect to each different set of a combination of all named power supply pins (e.g., VSS1, or VSS2 or VSS3 or VCC1, or VCC2) connected to terminal B. All pins except the one being tested and the power supply pin or set of pins shall be open. Each input and each output individually connected to terminal A with respect to a combination of all the other input and output pins connected to terminal B. All pins except the input or output pin being tested and the combination of all the other input and output pins shall be open
b.
c.
TERMINAL C
R1 S1 R2
TERMINAL A REGULATED HIGH VOLTAGE SUPPLY
S2 C1
DUT SOCKET
SHORT CURRENT PROBE (NOTE 6)
TERMINAL B
R = 1.5k C = 100pf
TERMINAL D
Mil Std 883D Method 3015.7 Notice 8
DOCUMENT I.D. 06-6202
REVISION A
MAXIM
TITLE: BI
Circuit (MAX1566/1567) PN07
PAGE
2

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